The WCD9341 is designed for audiophile-grade performance in mobile devices :
| Metric | WCD9341 | WCD9375 | WCD9370 | | -------------------- | --------------- | ----------- | -------------- | | Dynamic Range (Playback) | | 123 dB | 120 dB | | THD+N (Playback) | −109 dB | −105 dB | −96 dB | | Dynamic Range (Recording) | 109 dB | 109 dB | 104 dB | | Hi‑Fi Power | 34 mW | 28.52 mW | 16.1 mW | | Low‑Power Listening | 6 mW | 6 mW | 6 mW | | Playback Resolution | 384 kHz/32‑bit | 384 kHz/32‑bit | 192 kHz/24‑bit |
: Inability to record voice memos, dead microphone in calls. wcd9341 datasheet
The WCD9341 uses a high-density Wafer-Level Chip-Scale Package (WLCSP). Because the pins are laid out in a fine-pitch grid ball array, you must use the datasheet grid map to locate test points.
The is a high-performance audio codec developed by Qualcomm , famously marketed as part of their Aqstic audio technology platform. It is designed to provide high-fidelity (Hi-Fi) audio experiences for premium mobile devices, such as smartphones and tablets. Core Technical Specifications The WCD9341 is designed for audiophile-grade performance in
: Features high-fidelity ADCs (Analog-to-Digital Converters) that enable high-quality binaural audio capture for immersive recordings.
Microphone Activation Detection interface for low-power voice wake-up Digital I/O The is a high-performance audio codec developed by
Ensure that the SLIMbus and SoundWire digital clock and data lines maintain consistent trace impedance (typically 50 ohms single-ended) to prevent signal reflections. 5. Troubleshooting and Diagnostics
Another critical aspect of the design was the audio processing algorithms. The WCD9341 datasheet mentioned that the chip supported advanced audio processing features, such as acoustic echo cancellation (AEC) and noise reduction (NR). Emma was pleased to see that the chip could help her design to provide a more immersive audio experience.
| Parameter | Value | |--------------------------|--------------------------------| | DAC SNR (A-weighted) | 128 dB | | THD+N (DAC) | -108 dB | | ADC SNR (Mic input) | 102 dB | | Headphone Output Power | 2 × 40 mW into 32Ω @ 1% THD | | Supply Voltage (Analog) | 1.8 V / 1.2 V (internal LDO) | | Digital I/O Voltage | 1.2 V – 1.8 V (programmable) | | Package | 81-ball WLCSP (0.4 mm pitch) |
and other Snapdragon 835-powered devices like the HTC 10 and Xiaomi Mi Note 2. Hi-Fi Audio Systems